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Process Capability
RIGID PCB CAPABILITIES LIST
Product Features Standard Advanced Micro Electronics
PC Board Attributes
Min Layer count 1 1 1
Max Layer Count 30 32 36
Min Board Thickness .010" .004" .004"
Max Board Thickness 0.250" 0.250" 0.250"
Min Core Thickness .002" .002" .002"
Min Dielectric .002" .002" .002"
Min. Starting Copper Foil Weight 9 micron 3 micron 3 micron
Max. Finished Copper Thickness (O/L) 6 oz > 6 oz .0015"
Max. Finished Copper Thickness (I/L) 4 oz > 4 oz .001"
Maximum Panel Size 21" x 29" 21" x 29" 12" x 18"
Minimum Panel Size 12" x 18" 12" x 18" 8" x 8"
Smallest Mech Drill Diameter .0059" .004" .004"
Smallest Laser Drill Diameter .0040" / .0080" .0025" / .0100" .0025" / .0100"
Min Finished Hole Size .004" .002" Plated shut
Max Thru Hole Aspect Ratio 10:01 16:01 16:01
Max Blind Via Aspect Ratio .75:1 1.2:1 .8:1
Blind Via Finished Hole Size .004" Plated shut Plated shut
Buried Via Finished Hole Size .004" .002" .002"
Minimum Line Width (trace) and Spacing .003" .002" .00125"
Min Pad Size for test .005" .003" .003"
Process Pad Diameter D + .012" (1 mil annular ring) D + .010" (Tangency) D + .006"
Stacked vias Yes Yes Yes
Minimum Wire Bond Pad size > .006" .004" 0.0025"
Controlled Impedance Tolerance 10% 5% 5%
Solder Mask Registration .002" <.002" .002"
Solder Mask Feature Tolerance .001" .001" .001"
Solder Mask Min Dam Size .004" .004" .004"
Min. Diameter Rout Cutter Available .024" .021" .021"
Routed Part Size Tolerance .010" <.010" <.010"
Laser hole location Tolerance .0005" .0005" .0005"
Laser Routed Part Size Tolerance -
can only be done with panels <.032" thick .001" .001" .001"
Bow & Twist Tolerance Per IPC Spec Per IPC Spec Per IPC Spec
Thickness Tolerance 10% < 10% < 10%
Sequential Lam 3 or less lam cycles > 3 lam cycles > 3 lam cycles
Buried Vias 2 or less > 3 > 3
Blind Vias Yes Yes Yes
Conductive Filled Vias Yes Yes Yes - Cu plate shut
Non Conductive Filled Vias Yes Yes Yes
Surface Finishes
HASL (Vertical or Horizontal) Yes Yes No
Lead Free HASL Yes Yes No
OSP (Shikoku F2) Yes Yes Yes
OSP (Entek) Yes Yes Yes
ENIG (Electroless Nickel/Immersion Gold) Yes Yes Yes
ENEPIG (Electroless Nickel-Electroless Paladium-Immersion Gold) Yes Yes Yes
Immersion Silver Yes Yes Yes
Tin Nickel Yes Yes No
Electrolytic Soft Gold Yes Yes Yes
Electrolytic Hard Gold Yes Yes Yes
Selective Gold Yes Yes Yes
Solder Masks Finish
Solder Mask Finish
Semi - Glossy Yes Yes Yes
Glossy Yes Yes Yes
Matte Yes Yes Yes
Solder Mask Colors
Green Yes Yes Yes
Black Yes Yes Yes
Red Yes Yes Yes
Blue Yes Yes Yes
Yellow Yes Yes Yes
White Yes Yes Yes
Clear Yes Yes Yes
Bright White Yes Yes Yes
Purple Yes Yes Yes
Legend
Silkscreen
All colors Yes Yes Yes
Fab
Routed Array Yes Yes Yes
V Score, Edge to Copper 0.01" 0.007" 0.007"
V Score Angles 35°,45°,60° 35°,45°,60° 35°,45°,60°
Countersink Yes Yes Yes
Counterbore Yes Yes Yes
Bevel Yes Yes Yes
Milling +/- .003" +/- .003" +/- .001"
Edge Castellation Yes Yes Yes
Edge Plating Yes Yes Yes
Heatsinks Yes Yes No
Electrical Test
Flying Probe Test Yes Yes Yes
E-Fixture test Yes Yes Yes
Hi Pot(Break Down Voltage) Yes Yes Yes
Laminate Materials
Very Thin Film Yes Yes Yes
Arlon 85NT Yes Yes No
Bergquist Yes No No
Hybrid Constructions Yes Yes Yes
Isola FR406 Yes Yes Yes
Isola FR408 Yes Yes Yes
Isola IS410 Yes Yes Yes
Isola IS620 Yes Yes Yes
Isola P95 Yes Yes Yes
Isola P96 Yes Yes Yes
Iteq IT180 Yes Yes Yes
Panasonic R1766 Yes Yes Yes
Panasonic R1755 Yes Yes No
Panasonic Megtron Yes Yes No
Nelco N4000-13 Yes Yes Yes
Nelco N4000-29 Yes Yes No
Nelco BT N5000 Yes Yes Yes
Nelco N7000-2 Yes Yes Yes
No Flow Pre Preg Yes Yes Yes
Isola 370HR Yes Yes Yes
Polyclad Getek Yes Yes Yes
PSA Bond Film No Yes Yes
Rogers 3000 Series Yes Yes No
Rogers R4000 Series Yes Yes No
Rogers 5000 Series Yes Yes No
Rogers 6000 Series Yes Yes No
Rogers TMM Yes Yes No
Test Report
Microsection Yes Yes Yes
Solderability Yes Yes Yes
UL
94VO Yes Yes Yes
PCB Classifications
MIL-PRF-55110 Yes No No
MIL-PRF-31032/2 Yes No No
MIL-PRF-31032/1 Yes No No
IPC 6012, Class 1, 2 & 3 Yes Yes Yes
ISO 9001:2015 Yes Yes Yes
ISO 13485:2016 Yes Yes Yes
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