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ADVANCED PCB MANUFACTURING

No.	Item		Process capability parameter
1	PCB type		Rigid PCB
2	Base Material		See Below “Material” Chart
3	Layer Count		1-40 layers
4	Finished Copper Thickness		0.5-6 oz
5	Min trace width/spacing	Inner layer	2 / 2mil
6	Min trace width/spacing	Outer layer	2.5 / 2.5mil
7	Min Spacing Between Hole to Inner Layer Conductor		7mil
8	Min Spacing Between Hole to Outer Layer Conductor		6mil
9	Min Annular Ring for Via		3mil
10	Min Annular Ring for Component Hole		6mil
11	Min BGA Diameter		8mil
12	Min BGA Pitch		0.1mm
13	Min Hole Size		0.15mm(CNC)｜0.1mm(Laser)
14	Max Aspect Ratio		12:1
15	Min Soldermask Bridge Width		3mil
16	Soldermask / Circuit Processing Method		Film \| LDI
17	Min Thickness for Insulating Layer		2mil
18	HDI & Special Type PCB		HDI(1-3 steps)｜High frequency mix-pressing (2-14 layers)｜Buried capacitance & resistance, etc.
19	Surface Finish		ENIG｜HAL｜HAL lead free｜OSP｜Immersion Tin｜Immersion Silver｜Plating Hard Gold｜Plating Silver
20	Max PCB size		500*600mm

Advanced PCB High Performance Materials:

Item	Material for PCB Prototype	Material for Small and Medium Batch
General Tg FR4	shengyi S1141, Kingboard KB6160A	shengyi S1141
High-Tg Halogen-free	shengyi S1170G Halogen-free TG170, TU-862 HF TG170	shengyi S1170G Halogen-free TG170 ,TU-862 HF TG170
Medium Tg Halogen-free	shengyi S1150G Halogen-free TG150	shengyi S1150G Halogen-free TG150
High Halogen-free CTI	shengyi S1151G( CTI≥600V)	shengyi S1151G( CTI≥600V)
High CTI	shengyi S1600( CTI≥600V)Kingboard KB6160C	shengyi S1600( CTI≥600V)Kingboard KB6160C
Special Material (High low temperature)	shengyi SH260	shengyi SH260
High Tg FR4	S1000-2, S1000-2M, IT180A	S1000-2, S1000-2M, IT180A
Ceramic Powder Filled High Frequency	Rogers4003, Rogers4350, Arlon25N, shengyi S7136	Rogers4350, Rogers4003, shengyi S7136
PTFE High Frequency Material	Rogers, Taconic, Arlon, Taizhou wangling	Rogers, Taconic, Arlon, Taizhou wangling
High Frequency PCB PP	RO4450 0.1mm, shengyi Synamic6	RO4450 0.1mm, shengyi s6