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COPPER BASE PCB MANUFACTURING
 No.  Item  Process Capability Parameter
1  Base Material  Copper Core
2  Number of Layers  1 Layer, 2 Layers, 4 Layers
3  PCB Size

  1 Layer & 2 Layers:1200*300mm or 600*500mm

  Multi-layers: 600*500mm

4  Quality Grade  Standard IPC 2
5  Thermal Conductivity (ω/m-k)  2W, 3W, 8W, 12W
6  Board Thickness  0.8-2.0mm
7  Min Tracing/Spacing  4mil / 4mil
8  Plated Through-hole size  ≥0.2mm
9  Non-Plated Through-hole size  ≥0.8mm
10  Copper Thickness  1oz, 2oz, 3oz, 4oz, 5oz
11  Solder Mask  Green, Red, Yellow, White, Black, Blue, Purple, Matte Green, Matte Black, None
12  Surface Finish  Immersion Gold, OSP, Hard Gold, ENEPIG, Immersion Silver, None
13  Other Options  Countersinks, Castellated Holes, Custom Stackup and so on.
14  Certification  ISO9001, UL, RoHS, REACH


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