High frequency circuit board production process

Today I bring you a complete version of the production process of high-frequency circuit boards. I hope to give you a deeper understanding of the production of high-frequency circuit boards!

　　 open material

　　 Purpose: According to the requirements of the engineering data MI, the large sheets that meet the requirements are cut into small production plates. Small sheets that meet the customer's requirements.

　　Process: large sheet → cutting board according to MI requirements → curium board → beer fillet\grinding → board out

　　 drilling

　　 Purpose: According to the engineering data, drill the required hole diameter in the corresponding position on the sheet material that meets the required size.

　　 process: stacked plate pin → upper plate → drilling → lower plate → inspection\repair

　　 sink copper

　　Purpose: Immersion copper is to deposit a thin layer of copper on the wall of the insulating hole by chemical method.

　　 process: rough grinding → hanging board → automatic copper sinking line → lower board → dipping% dilute H2SO4 → thickened copper

　　 Graphics transfer

　　Purpose: Graphic transfer is to transfer the image on the production film to the board

Process: (blue oil process): grinding plate → printing one side → drying → printing the second side → drying → exploding → developing shadow → inspection; (dry film process): hemp board → pressing film → standing → aligning → Exposure→Standing→Development→Inspection

　　 Graphic plating

　　Purpose: Pattern electroplating is to electroplate a copper layer with a required thickness and a gold-nickel or tin layer with the required thickness on the bare copper skin or hole wall of the circuit pattern.

　　 process: upper board → degreasing → second water washing → micro-etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower board

　　Remove film

　　Purpose: Use NaOH solution to remove the anti-plating coating film to expose the non-circuit copper layer.

　　 Process: water film: insert rack → soak alkali → rinse → scrub → pass machine; dry film: release board → pass machine

　　Etch

　　Purpose: Etching is to use a chemical reaction method to corrode the copper layer of non-circuit parts.

  green oil

　　Purpose: Green oil is to transfer the graphic of the green oil film to the board to protect the circuit and prevent the tin on the circuit when welding parts

　　Process: grinding plate→printing photosensitive green oil→curing plate→exposure→exposure; grinding plate→printing one side→drying plate→printing second side→drying plate

　　 character

　　Purpose: Characters are provided as a mark for easy identification

　　Process: After the green oil finishes → cool and stand → adjust the screen → print characters → back

　　Gold finger

　　Purpose: to plate a nickel/gold layer of required thickness on the plug finger to make it more hard and wear-resistant

　　 process: upper plate → degreasing → washing twice → micro-etching → washing twice → pickling → copper plating → washing → nickel plating → washing → gold plating

　　 Tin plate (a process in parallel)

　　Purpose: spray tin is to spray a layer of lead tin on the bare copper surface that is not covered with solder mask to protect the copper surface from corrosion and oxidation to ensure good soldering performance.

　　 process: micro-erosion → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying

　　 molding

　　Purpose: Organic gongs, beer board, hand gongs, hand-cutting methods to produce the shape required by the customer through die stamping or CNC gong machine

　　 Description: The accuracy of the data gong machine board and the beer board is higher. The hand gong is second, and the minimum hand-cutting board can only make some simple shapes.

  test

　　 Purpose: To pass electronic 100% testing to detect defects that affect functionality such as open circuits and short circuits that are not easy to find visually.

　　 Process: upper mold → release board → test → pass → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap

  Final inspection