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Standard PCB Manufacturing

FR-4 PCB Capabilities





No. ItemManufacturing Capabilities            Illustration            
1MaterialFR-4 (Fiberglass)For Rogers, Taconic, ARLON and other HDI boards, please contact  APOLLOPCB for details.
2Number of Layers

1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers,

10 Layers

Standard stackup for multilayer pcbs.
3TG Grade

TG130~140, TG150~160, TG170~180


4Max PCB Size

1 layer & 2 layers: 1200*300mm or 600*500mm

Multi-layers: 600*500mm

        1-210421092625a9.png 

5Min PCB Size5mm*5mm
6Board Size Tolerance(Outline)

±0.2mm(CNC routing)

±0.5mm(V-scoring)

7Surface Finish

HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None

1-210421092644A4.png

8Board Thickness

1 Layer/2 Layers: 0.2~2.4mm

4 Layers: 0.4~2.4mm

6 Layers: 0.8~2.4mm

8 Layers: 1.0~2.4mm

10 Layers: 1.2~2.4mm


               

Note: Customized PCB thickness and Layer stackup are acceptable.

9Board Thickness Tolerance

Thickness≥1.0mm: ±10%

Thickness<1.0mm: ±0.1mm


               

Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.

10Outer Layer Copper Thickness

1oz/2oz/3oz

(35μm/70μm/105μm)


               

Note: 

2oz

PCB thickness≥1.2mm,

Via size≥0.25mm,

Min Track/Spacing≥0.15mm 


               

3oz

PCB thickness≥2.0mm,

Via size≥0.3mm,

Min Track/Spacing≥0.2mm

1-210421092FN04.png

11Inner Layer Copper Thickness

1oz/1.5oz

(35μm/50μm)

12

Outer layer Min track/spacing

≥3mil

1-210421092H3401.png

13

Inner layer Min track/spacing

≥4mil
14Annual ring size≥0.13mm
15Grid Line track/spacing≥0.2mm

1-210421092J2109.jpg

16Coil board Line track/spacing≥0.2mm  

1-210421092PE28.png

17BGA pad size≥0.2mm

1-210421092TK07.png

18BGA Distance≥0.12mm
19Board Outlines

Track to Outline: ≥0.3mm 

Trace to V-cut line: ≥0.4mm

        

1-210421093320394.png

20Finished Hole Size Tolerance±0.08mm

1-210421093139642.png

21Finished Hole Diameter(CNC)

0.2mm~6.3mm


               

1. PCB Thickness=2.0mm, Min

hole size is 0.3mm

2. PCB Thickness=2.4mm, Min 

hole size is 0.4mm

3. Copper Thickness=2OZ, Min 

hole size is 0.25mm

4. Copper Thickness=3OZ, Min 

hole size is 0.3mm

22TH Via Distance

Equipotential: 0.15mm

Isoelectric: 0.25mm

23Plated Slot Size

≥0.5mm


               

Note:

L:W=2.5: 1 (Should be 2.5:1 or 

higher. If it is less than this, the holes may be misaligned.)  If you can't draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of  Drilling Layer.

1-210421093220220.png

24Castellated Holes≥0.6mm

1-2104210932401N.png

25Non-Plated Holes≥0.8mm

1-210421093259455.png

26NPTH to Copper Line≥0.2mm
27SoldermaskGreen, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None  

1-210421093400a3.png

28Soldermask Thickness

20~30um

29Soldermask Bridge

Green: ≥0.1mm

Others: ≥0.15mm

1-2104210934231T.png

30Soldermask to soldering pad distance≥0.05mm
31SilkscreenWhite, Black, Yellow, None

1-21042109350N46.png

32Minimum Character Width(Legend)

≥0.15mm


               

Note: Characters of less than 0.15mm wide will be too narrow to be identifiable.

33Minimum Character Height (Legend)

≥0.75mm


               

Note: Characters of less than 0.8mm high will be too small to be recognizable.

34Character Width to Height Ratio (Legend)

1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio)

35Silkscreen to Soldermask Distance≥0.1mm
36V-cut Line

≥75mm


               

Note:

PCB thickness≥0.6mm

Details refer to right side 

picture

1-210421093540c4.png

       

37V-cut Line Distance≥3.5mm

1-210421093604194.png

38Distance betwen Board to Board0.8mm

1-210421093625255.png

39Stamp-hole Width

2.0mm


               

Note: PCB size and thickness are subject to review by APOLLOPCB.

40Tab-route Width

≥1.6mm


               

Note: PCB size and thickness are subject to review by APOLLOPCB.

41Edge Rail

≥3.5mm


               

Note: If choosing panel by APOLLOPCB, we will add 5mm edge rails on both sides by default.

        

1-210421093645550.jpg

42Gold Finger

Bevelling Angle: 30~45°

Depth: ≥1mm

Length: 45mm~280mm


               

Note: Board thickness≥1.2mm

1-210421093G6227.png

43Special Specification

Impedance control

Custom Layer Stackup

Interstitial Via Hole(IVH)

Via in pad

Via filled with resin

Countersinks/Counterbores

Carbon Mask

Halogen-Free

Z-axis milling

Edge Plating

Others

1-210421093P45a.png


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