How do PCB aluminum substrate manufacturers solve the heat dissipation problem of LED

The heat dissipation problem of LEDs is the biggest headache for manufacturers, but aluminum substrates can be used, because aluminum has high thermal conductivity and good heat dissipation, which can effectively remove internal heat. Aluminum substrate is a unique metal-based copper clad laminate with good thermal conductivity, electrical insulation properties and mechanical processing properties. When designing, it is also necessary to place the PCB as close to the aluminum base as possible to reduce the thermal resistance generated by the potting compound.

　　 One, the characteristics of aluminum substrate

　　 1. Using surface mount technology (SMT);

　　2. Very effective treatment of heat dissipation in the circuit design scheme;

　　3. Reduce product operating temperature, improve product power density and reliability, and extend product life;

　　4. Reduce product volume, reduce hardware and assembly costs;

　　 5. Replace fragile ceramic substrates to obtain better mechanical durability.

　　 2. The structure of the aluminum substrate

　　 Aluminum-based copper clad laminate is a metal circuit board material, composed of copper foil, thermally conductive insulating layer and metal substrate. Its structure is divided into three layers:

　　Cireuitl.Layer circuit layer: equivalent to the copper clad laminate of ordinary PCB, the thickness of the circuit copper foil is loz to 10oz.

　　DiELcctricLayer insulating layer: the insulating layer is a layer of low thermal resistance and thermal conductivity insulating material.

　　 BaseLayer base layer: is a metal substrate, generally aluminum or copper can be selected. Aluminum-based copper clad laminates and traditional epoxy glass cloth laminates, etc.

The circuit layer (that is, copper foil) is usually etched to form a printed circuit to connect the components of the component. Generally, the circuit layer requires a large current-carrying capacity, so thicker copper foil should be used, with a thickness of 35μm~ 280μm; The thermal insulation layer is the core technology of the aluminum substrate. It is generally composed of a special polymer filled with special ceramics. It has low thermal resistance, excellent viscoelasticity, thermal aging resistance, and can withstand mechanical and thermal stress.

The thermal insulation layer of the high-performance aluminum substrate uses this technology to make it have extremely excellent thermal conductivity and high-strength electrical insulation performance; the metal base layer is the support member of the aluminum substrate and requires high thermal conductivity, usually aluminum plate , Copper plate can also be used (the copper plate can provide better thermal conductivity), which is suitable for conventional machining such as drilling, punching and cutting. Compared with other materials, PCB materials have incomparable advantages. Suitable for surface mount SMT public art of power components. No radiator is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation performance and mechanical performance are good.

　　 Three, the use of aluminum substrate:

　　 Application: Power Hybrid IC (HIC).

　　 1. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, pre-amplifiers, power amplifiers, etc.

　　 2. Power supply equipment: switching regulator, DC/AC converter, SW regulator, etc.

　　3. Communication electronic equipment: high-frequency amplifier `filter electrical` transmission circuit.

　　 4. Office automation equipment: motor drives, etc.

　　 5. Automobile: electronic regulator, igniter, power controller, etc.

　　6. Computer: cpu board, floppy disk drive, power supply device, etc.

　　7. Power modules: converters, solid relays, rectifier bridges, etc.