The led aluminum substrate module is a metal-based copper clad laminate with good heat dissipation function. Its working principle is that the surface of the power device is mounted on the circuit layer. The heat generated during the operation of the device is quickly transferred to the metal base layer through the insulating layer, and then the metal base layer The heat is transferred out, so as to realize the heat dissipation of the device.

The copper foil used for the 　　led aluminum substrate is 1oz, 2oz, and 3oz, which are mainly made of wire drawing, with uniform and delicate texture, and the appearance of the aluminum oxide plate is also pleasing to the eye. Sulfuric acid anodic oxidation is also the main method, the oxide layer is crystal clear and feels perfect.

Features of 　　led aluminum substrate module:

　　 1. Heat dissipation

　　 Aluminum substrate heat dissipation and its insulation layer density, thermal conductivity, the thinner the insulation layer, the higher the thermal conductivity.

　　2, mechanical function

　　The aluminum substrate has high mechanical strength and durability, so it can be printed on the aluminum substrate.

　　3, electromagnetic shielding function

　　Aluminum substrate can be used as a shielding board to shield electromagnetic waves.

　　4, thermal expansion coefficient

　　Because the general copper cladding has a question of thermal expansion, it is easy to affect the quality of the metal holes and wires. The thermal expansion coefficient of the aluminum substrate is smaller than that of the copper composite board, which helps to ensure the quality and reliability of the printed circuit board.