What are the difficulties in the production process of aluminum substrates?

　Aluminum substrate is a metal-based copper clad laminate with good heat dissipation function, which is mostly used to make LED lights. Let us understand the difficulty analysis and production specifications of the aluminum substrate manufacturing process below.

　　 1. Aluminum substrates are often used in power devices, and the power density is high, so the copper foil is relatively thick. If copper foil of more than 3oz is used, the etching process requires engineering design line width compensation.

　　2. The aluminum base surface of the aluminum substrate is protected in advance with a protective film during PCB processing. Otherwise, some chemicals will attack the aluminum base surface and cause damage to the appearance.

　　 3. The hardness of the milling cutter used in the production of fiberglass board is relatively small, and the milling cutter speed is fast; while the milling cutter used in the production of aluminum substrate is hard, the milling cutter speed is at least two-thirds slower.

　　 4. The production of fiberglass board only needs to use the heat dissipation system of the machine itself to dissipate heat, but the processing of the aluminum substrate requires alcohol to dissipate heat.

　　 5. Aluminum substrate manufacturers will have some difficulties in the process of producing aluminum substrates. These difficulties are as follows:

　　(1) The aluminum substrate is produced by mechanical processing, and no burr is allowed on the edge of the hole after drilling, otherwise it will affect the withstand voltage test. The process of milling the shape of the aluminum substrate is very difficult, and the punching shape requires the use of advanced molds. After the contour is punched, the edges are required to be neat, free of burrs, and not to damage the solder mask on the edge of the board. Normally, a soldier mold is used. The hole is punched from the line and the shape is punched from the aluminum surface. After punching the shape, the warpage of the board should be less than 0.5%.

　　 (2) In the entire aluminum substrate production process, it is not allowed to wipe the aluminum base surface, touch it by hand, or cause surface discoloration and blackening through certain chemicals, which is unacceptable. Therefore, one of the difficulties in the production of aluminum substrates is that the entire process does not scratch or touch the aluminum base surface.

(3) When the aluminum substrate is subjected to high voltage test, the communication power aluminum substrate requires 100% high voltage test. Dirt, holes, burrs on the aluminum base edge, line sawtooth or bumps on the aluminum substrate will cause a fire in the high voltage test. , Leakage, breakdown. The delamination and blistering of the pressure test board were rejected.